Supply power for semiconductor diode lasers 半導(dǎo)體激光器專(zhuān)用電源
One of the key problems is lasers cooling in researching high power semiconductor diode laser arrays 大功率半導(dǎo)體激光器列陣研制的關(guān)鍵問(wèn)題之一就是散熱技術(shù)。
By testing , the total thermal of the microchannel heatsink for cooling high power semiconductor diode laser arrays is 0 . 645 / w , which is consistent with the result of theory counting 通過(guò)測(cè)試,所制得的無(wú)氧銅微通道熱沉冷卻半導(dǎo)體激光器的總熱阻為0 . 645 ~ 0c w ,與理論分析基本吻合,滿足散熱要求。
In order to increase the output power , reliability and stabilization , microchannel heatsink which is one of active heatsinks is used to cool high power semiconductor diode laser arrays in the paper 為了提高激光器的輸出功率、可靠性和穩(wěn)定性,本論文選取有源熱沉? ?微通道熱沉來(lái)冷卻大功率半導(dǎo)體激光器列陣。